This packaging technology integrates multiple miniature chips, known as chiplets, into a single customized processor. Over the last half-year, Intel has indicated that its advanced packaging division—part of its Foundry business—is experiencing rapid expansion. This initiative places Intel in direct competition with Taiwan Semiconductor Manufacturing Corporation, which currently dominates the market in production volume. However, with artificial intelligence fueling demand for specialized computing hardware and prompting numerous tech giants to design proprietary chips, Intel believes its packaging expertise can secure a larger role in the AI sector.
A CLI RSS/Atom feed reader inspired by Taskwarrior.
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Российский военкор рассказал о поступке «взрослого лидера»03:04
ilso、RNW如薇展开“王位”争夺战：不同于白牌“走马灯式”轮番登场，佩莱集团旗下品牌RNW如薇，以及韩国品牌ilso，始终稳居前二。
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